
GaN HEMTs (high electron mobility transistors) have been proving to be valuable for the radio frequency and power industries for years. Thanks to their high-density two-dimensional electron gas, which creates a conducting channel and enables large charge flow. High breakdown voltage, high electron saturation velocity, and great thermal stability (200-300°C) are other added advantages of GaN. However, with time, the demand for high-frequency devices and increasing numbers of transistors on processing units has resulted in large heat generation during operation.
Existing GaN HEMTs suffer from self-heating issues, resulting in reduced device performance and operating life. The best solution to achieve effective thermal conductivity is to integrate GaN with diamond, due to the high thermal conductivity of diamonds.
In this blog, we will explore which industries stand to benefit most from GaN-on-Diamond HEMTs, and why this technology is becoming a game-changer for different sectors.
Effectively addressing thermal bottlenecks is one of the key benefits of GaN-on-Diamond HEMTs. The thermal conductivity of diamonds exceeds that of silicon carbide (up to 5 times) and silicon (up to 10 times). This property helps operate the devices at high power levels smoothly and without resulting in any thermal runaway. With these bonding innovations, the thermal boundary resistance has reached to about 3.1 m²K/GW, resulting in practical implementation in real-world systems.
These benefits make GaN-on-Diamond perfect for industries where thermal management is required for demanding industrial applications.
The benefits of GaN-on-Diamond HEMTs are felt most strongly in industries where heat is the single biggest barrier to performance. Let's explore the sectors set to gain the most from this technology:

Today 5G networks, satellite communications and advanced radar systems are seeing exponential growth. 5G systems require power amplifiers that are capable of handling high data sets within compact base stations. They require higher frequencies, greater bandwidth and excellent beam-foaming capabilities.
Bonding GaN with diamond will help bring down the thermal resistance from the active channel to the heat sink by about 3 to 4 times. This reduction directly helps improve the performance. It starts with reduction in junction temperature which directly influences the reliability of devices.
If the thermal management is well managed it also significantly enhances the power densities. Using diamond substrates helps GaN devices handle much higher power without overheating. This means manufacturers can build smaller amplifiers with similar levels of power which will reduce the overall size, weight, and cost of electronic systems.
Additionally, when it comes to 5G networks, this improved efficiency can lower energy consumption and reduce cooling requirements, helping to cut operating costs.

To ensure optimal functioning, electric vehicles require effective energy conversion, compact electronics and reliable thermal management. From handling hard acceleration to regenerative braking to fast charging, every aspect results in short bursts of heat. This heat is generated by the system for protecting performance and device longevity.
Though GaN devices have been addressing this issue over the years, today, diamond-based thermal management is proving to be more valuable. Diamond packs in advanced thermal solutions that result in efficient, compact GaN power converters and RF amplifiers. These are ideally used in demanding applications including electric vehicles, 5G telecommunications, and aerospace.

One of the strongest adopters of GaN-on-Diamond technology are defense applications. These applications push power density and reliability limits. This is exactly where diamond's cooling advantage will pay off.
Additionally, radar and electronic-warfare systems operate at high power for sustained periods. This causes heat which if not spread evenly will affect performance and the lifespan of mission-critical hardware. GaN-on-Diamond power amplifiers are particularly valuable owing to the following advantages:

When it comes to wireless power transfers, GaN-on-Diamonds are proving to deliver exceptional performance. It can drastically reduce power loss and prevent performance degradation, making them useful for high power transmitters. Some of the key advantages include:
The following table highlights the properties of diamonds in comparison to silicon and silicon carbide:
The growing demand for high electron mobility transistors (HEMTs) has been a significant driver for the GaN-on-Diamond semiconductor substrates market. The adoption of satellite communication systems is on the rise leading to further expansion of the GaN-on-Diamond semiconductor market.
Several advantages of GaN-on-Diamond substrates are driving this growth including excellent thermal conductivity and high breaking point for voltage. In 2025, the global GaN-on-Diamond semiconductor market was valued at USD 42.80 billion.
Whereas the total GaN-on-Diamond semiconductor substrate is expected to grow from 11.2% from 2026 to 2032. This number is expected to reach around USD 89.98 billion.
The different industries where GaN is proving to be valuable have one common problem - to drive away heat. Effective heat management at the source is critical for optimal performance, whether in 5G base stations or EV charging systems.
At AGA9, this is precisely what we specialise in. Backed by a strong commitment to sustainability and resource-efficient manufacturing, AGA9 is here with their next-generation thermal solutions.
Looking to source CVD diamonds for your application? Contact our team to discuss your requirements or request detailed specifications.
GaN-on-Diamond HEMTs are slowly and steadily gaining traction. This combination brings the high-power of gallium nitride with the exceptional thermal conductivity of diamonds. GaN-on-Diamond is said to improve the efficiency of high-power amplifiers in satellite communication systems, high-frequency radar systems, and artificial-intelligence (AI) data centers. This in turn will contribute to reducing power consumption.
Advancement in electronic systems is set to push performance boundaries. Here is where GaN-on-diamond is set to offer a reliable solution resulting in faster, compact and energy-efficient devices. This upcoming combination is here to redefine the future of semiconductors, leading the way for high-performance power electronics.
Here are some interesting FAQs on GaN-on-Diamond HEMTs:
“redefining one diamond layer at a time”